• Lead-free solder wire designed to improve quality in manual and robotic work. • 0.3 mm diameter with a weight of 100 g. • Sn99.3Cu0.6Ni0.05 alloy with 3.5% flux content. • 100% guaranteed continuous flux core for consistent and optimized performance. • Patented Reduced Splash function that increases user safety and keeps the work area clean. • Creates long-term durable solder joints without cracking, even on difficult surfaces. • Reduces tip consumption by up to 70%, decreasing work time and operating costs.