• Ready-to-use paste adhesive designed for installing Depron boards on irregular or damaged ceilings and walls. • Suitable for bonding thin insulators such as extruded or expanded polystyrene up to 6 mm thick. • Solvent-free formula suitable for porous substrates, blocked paint-type backgrounds, or corrosion-protected metal surfaces. • Putty consistency that prevents dripping during application on walls or ceilings. • Ability to correct slight planimetry defects in the substrate. • Provides immediate grip that facilitates material placement and positioning. • Offers an ultra-strong final bond.